Upon receiving the design files and requirements, Wells’s experienced engineering team will conduct a thorough review of your circuit design, schematic diagram, and any supporting manufacturing documents, prior to the formal fabrication of the PCB. This comprehensive review is beneficial in ensuring the success of the project, and can help avoid potential issues or failures downstream, thereby increasing the efficiency of the production schedule.

Once the review is complete, our team will provide a price list as soon as possible based on your specific needs. Upon agreement of the details of the cooperation, our service will begin.

The substrate material (copper clad laminate) is cut into the desired shape using a cutting machine at Wells. This process is automated, with the operator inputting the basic data of the PCB into the machine to ensure precision and accuracy. Once cut, the boards undergo additional processing such as sanding and baking to prepare them for the next stage of the manufacturing process.

Upon completion of the fabrication of the inner layer circuit, it is subjected to AOI to verify its integrity. This inspection method utilizes optical principles to detect defects in circuit board manufacturing and is considered one of the most reliable methods.

The process of hole metallization is critical to achieve electrical conductivity between layers of a PCB, which is essential for carrying components. Two commonly used technologies for hole metallization include PTH and black hole plating.

PTH involves a chemical redox reaction where a layer of copper is deposited onto the hole. This process offers flexibility in adjusting plating parameters such as thickness and is widely used in the production of industrial control boards.

Black hole plating, on the other hand, entails coating the hole surface with graphite or black carbon powder to form a conductive layer. This is a low cost PCB manufacturing method.

The manufacturing process for the outer layers of a PCB shares some similarities with that of the inner circuit fabrication. However, there is a key difference in that dry film lamination is specifically required for outer layer circuit fabrication, and the type of laminate used differs from that used in the inner layers to accommodate for any design requirements that may vary.

This is a secondary plating process (also known as pattern plating) which is typically done after the dry film lamination process (previous step) is carried out to plate the additional dry film parts. Before graphic plating is performed, the surface of the board needs to be prepared with a variety of treatment methods which includes surface degreasing, micro-etching, and acid pickling treatment. Due to copper being applied during the first plating process, a layer of tin is now added to prevent the plated, exposed copper from oxidizing and to protect all of the necessary conductive material from being removed during outer layer etching.

Achieving optimal Fabrication quality while managing costs is a top priority for engineers. Addressing this challenge, we offer AOI testing as a reliable method to ensure superior quality throughout the production process, from inner layer and outer layer fabrication to PCB assembly. AOI system utilizes advanced cameras and scanners, complemented by cutting-edge software algorithms, to meticulously detect physical manufacturing defects. Unlike other inspection methods, AOI does not require additional financial investment, resulting in reduced PCB fabrication costs.

Applying a thin coating on the outer solderable surfaces of the circuit board, this layer helps to prevent oxidation of the copper and provides isolation of conductive materials that are close in proximity to each other to avoid arcing.

Printed silkscreen layer in the final stage of PCB board production. This layer plays a vital role in identifying the components, logos, text, and other visually distinguishable elements on the printed circuit board.

Customized screen printing offers a range of benefits, both aesthetic and functional. It not only enhances the visual appeal of your PCB circuit but also facilitates efficient assembly processes. By utilizing advanced inkjet printing technology, we ensure precise and accurate placement of the silkscreen layer.

By choosing Wells’s PCB production service, you gain access to a wide array of surface finishing solutions. Our team of experts can guide you in selecting the most suitable finish based on your board’s application and compatibility with the components used. Our range of surface finishing options includes tin-lead HASL, lead-free HASL, OSP, immersion silver, immersion tin, ENIG, hard gold, chemical nickel plating, ENEPIG, and more.

Testing is a critical post-production step that ensures proper functionality and production of the product before it is sent out to customers and this is done by both specialized equipment and expert in-house engineers that perform a thorough testing process. Some PCB testing methods used may include in-circuit testing, visual inspections, flying probe testing, AOI, functional testing, automated x-ray inspection, burn-in testing and other more specific tests (depending on the board application). With the series of tests conducted, the PCB products will be tested for any shorts, component issues, incompatibility during production, physical defects, soldering errors, overall board function, etc before it is shipped out to customers.

In order to meet the products’ dimensional requirements (specific sizes & shapes of the boards), profiling is carried out to mechanically form a small rectangular cut through the board so that the PCB can be separated from the production panel and into individual panels (according to the dimensional requirements). There are three main types of profiling: milling/routing, V-scoring and punch profiling. Except for punch profiling, the two other methods utilize a very specific CNC machine to make the cuts,    whether it is a rectangular cut (milling) or a triangular cut (V-scoring). Punch profiling, on the other hand, is a much more efficient method as it makes use of a punch machine to  craft a standard hole in the circuit board.

After the manufacturing and testing process takes place, the products are packaged safely using a variety of packing materials (bubble bags, electrostatic bags, vacuum packs, etc.) to prevent any static & physical damage to the finished product during shipping/transportation.

Our team comprises skilled designers who specialize in manufacturing and assembly. However, we are also capable of providing design services and upgrades as per your requirements.

At Wells, we prioritize quality and efficiency as our core values. We understand the importance of timely execution for time-sensitive projects without compromising on production quality. Our commitment to speed encompasses rapid quotations, streamlined communication, personalized one-to-one service, and more. Rest assured that when you engage with us, our dedicated service begins irrespective of your final decision to choose our services or not.

With two decades of experience in the PWB manufacturing industry, Wells has successfully catered to clients from diverse sectors. We strictly adhere to the implementation standards set by IPC-A-610-G and hold essential certifications required for industries such as medical and automotive. Notably, we have provided PCB fabrication for military projects in Bangladesh, showcasing our capabilities in meeting rigorous requirements. Please feel free to reach out to us for more information on our past engagements.

Our PCB fabrication services for prototypes go beyond the basics. We offer comprehensive part-free testing and conformal coating services to ensure the refinement and functionality of the manufactured products. Leveraging cutting-edge 3D printing capabilities, rapid prototyping enables time savings and facilitates the identification of design flaws that require adjustments for mass production. At Wells, we have no MOQ restrictions, allowing clients to order even a single piece of PCB for manufacturing. Our services cover prototype production, small-scale production, large-scale production, and customized solutions.